Product Details
Place of Origin: China
Brand Name: zmkj
Certification: Cz/ Rohs/ GSG
Model Number: 4.125/6.125/6inch/8inch
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: by case
Packaging Details: by substrates cassette box
Delivery Time: 3-4weeks
Payment Terms: Western Union, T/T, L/C
Supply Ability: 100pcs
Material: |
Al2O3 Monocrystalline |
Orientation: |
C Plane |
Surface: |
Dsp Or Ssp |
Thickness: |
650 Um +/- 25 Um (SSP) , 600 Um +/- 25 Um (DSP) |
Ttv: |
<20um |
Application1: |
Semiconductor Carrier Plate/sos/ Pss/optical |
Application2: |
Semiconductor Etching Epitaxy Carrier |
Material: |
Al2O3 Monocrystalline |
Orientation: |
C Plane |
Surface: |
Dsp Or Ssp |
Thickness: |
650 Um +/- 25 Um (SSP) , 600 Um +/- 25 Um (DSP) |
Ttv: |
<20um |
Application1: |
Semiconductor Carrier Plate/sos/ Pss/optical |
Application2: |
Semiconductor Etching Epitaxy Carrier |
4inch 100um 200um 300um thickness sapphire wafer quartz glass
4inch Sapphire Wafer C-Plane Single or Double Side Polished Al2O3 Single Crystal
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8inch Dia 159mm Single Crystal Sapphire Wafer For Epi - Ready Carrier
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What is the composition of sapphire wafer?
Synthetic Sapphire is single crystal form of Aluminium Oxide (Al2O3). It exhibits unique physical and chemical properties like high temperature resistance, thermal shocks resistance, high strength, scratch resistance, low dielectric loss and good electrical insulation.
Why choose Single Crystal Sapphire products?
Single crystal sapphire possesses excellent optical, physical and chemical properties. It is the hardest oxide crystals, and remains high strength and chemical resistance at high temperatures. It also features a wide transmission wavelength range, great electrical insulation, and good thermal conductivity at low
temperatures.
Specifications of Sapphire Wafer, 4 inch, C-plane (0001), Prime Grade
Item | 4-inch C-plane(0001) 650μm Sapphire Wafers | |
Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 | |
Grade | Prime, Epi-Ready | |
Surface Orientation | C-plane(0001) | |
C-plane off-angle toward M-axis 0.2 +/- 0.1° | ||
Diameter | 100.0 mm +/- 0.1 mm | |
Thickness | 650 μm +/- 25 μm | |
Primary Flat Orientation | A-plane(11-20) +/- 0.2° | |
Primary Flat Length | 30.0 mm +/- 1.0 mm | |
Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
(DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
TTV | < 20 μm | |
BOW | < 20 μm | |
WARP | < 20 μm | |
Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, | |
25 pieces in one cassette packaging or single piece packaging. |
Electrical Properties of Sapphire
Resistivity, Ohm x cm at 200-500 °C: 1011- 1016
Dielectric constant: 10.0
Dielectric strength, V/cm: 4 x 105
Loss tangent: 1 x 10-4
Application
Some key properties of sapphire wafers include their high thermal conductivity, high mechanical strength, excellent chemical and scratch resistance, and transparency in the visible and near-infrared regions of the spectrum. These properties make sapphire wafers well-suited for a wide range of applications in harsh environments, such as high temperature, high pressure, and corrosive conditions.
How does the thickness of a 4-inch sapphire wafer affect its performance?
The thickness of a 4-inch sapphire wafer can have a significant impact on its performance depending on the specific application. Here are a few ways in which thickness can affect performance:
1. Mechanical strength: Thicker sapphire wafers generally have higher mechanical strength and are more resistant to cracking or breaking under mechanical stress. This can be important in applications where the wafer may be subjected to high mechanical loads or rough handling.
2. Optical properties: The thickness of a sapphire wafer can affect its optical properties, such as transmission, reflection, and scattering. For example, thinner wafers may transmit more light than thicker wafers, but may also be more susceptible to surface defects or light scattering.
3. Thermal conductivity: Thicker sapphire wafers generally have higher thermal conductivity, which can be important in applications where the wafer is exposed to high temperatures and needs to dissipate heat efficiently.
4. Electrical properties: The thickness of a sapphire wafer can also affect its electrical properties, such as resistance and capacitance. For example, thinner wafers may have lower resistance but higher capacitance than thicker wafers.
Production process
1. Crystal growth: Single-crystal sapphire is typically grown using the Verneuil method or the Kyropoulos method. In the Verneuil method, a powdered form of aluminum oxide (Al2O3) is melted using a high-temperature flame and then allowed to cool and solidify into a single crystal. In the Kyropoulos method, a seed crystal is dipped into a bath of molten Al2O3 and slowly withdrawn while rotating, allowing the crystal to grow from the melt.
2. Cutting and shaping: Once the crystal has been grown, it is cut into wafers using a diamond saw or laser. The wafers are then shaped and polished to the desired thickness and surface finish.
3. Cleaning: The sapphire wafers are cleaned using a combination of mechanical, chemical, and ultrasonic methods to remove any surface contaminants and prepare the surface for further processing.
4. Doping: In some cases, dopants may be added to the sapphire wafers to alter their electrical or optical properties. This is typically done using ion implantation or diffusion methods.
5. Etching: The sapphire wafers may be etched using a variety of chemical or plasma-based processes to create patterns or features on the surface. This is commonly used in the fabrication of microelectronic devices.
6. Metrology: The sapphire wafers are then subjected to various metrology techniques to measure their thickness, flatness, surface roughness, and other properties. This is important to ensure that the wafers meet the required specifications for the intended application.
7. Packaging: The final step in the production process is to package the sapphire wafers for shipment to customers. This typically involves placing the wafers in protective containers to prevent damage during transportation and storage.
Packing of sapphire wafers
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FAQ:
Q: What's your MOQ?
A: (1) For inventory, the MOQ is 10pcs.
(2) For customized products, the MOQ is 25pcs up.
Q: What's the way of shipping and cost?
A:(1) We accept DHL, Fedex, EMS etc.
(2) If you have your own express account, it's great.If not,we could help you ship them.
Freight is in accordance with the actual settlement.
Q: What's the delivery time?
For inventory: the delivery is 5 workdays after you place the order.
For customized products: the delivery is 2 or 3 weeks after you place the order.
Q: Do you have standard products?
A: Our standard products in stock.as like 4inch 0.65mm,0.5mm polished wafer.
Q: How to pay?
A:50%deposit, left before delivery T/T,
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications and optical coating for your optical
components based on your needs.