Product Details
Place of Origin: China
Brand Name: ZMSH
Model Number: Sapphire wafer
Payment & Shipping Terms
Delivery Time: 2-4 weeks
Payment Terms: T/T
Material: |
Monocrystalline Al2O3 |
Purity: |
99.999% |
Orientation: |
C-axis |
Dia: |
300mm |
Thickness: |
1000um |
Thickness Tolerance: |
25um |
Material: |
Monocrystalline Al2O3 |
Purity: |
99.999% |
Orientation: |
C-axis |
Dia: |
300mm |
Thickness: |
1000um |
Thickness Tolerance: |
25um |
Sapphire Substrate, Sapphire Wafer, Sapphire Singal Crystal Wafer, Al2O3 wafer, High-Purity Al2O3 substrate, High-Hardness wafer, High-Performance Sapphire wafer, Al2O3 Single Crystal Wafer
· Crafted from synthetic sapphire with an aluminium oxide (Al₂O₃) purity of 99.999%.
· Boasts a Mohs hardness rating of 9.0, ensuring superior scratch resistance and durability.
· Offers 85% visible light transmissivity, providing exceptional clarity and visibility.
· Supports customization based on provided design drawings.
· Delivers high performance, even in challenging and harsh environments.
*This is the high thickness sapphire wafer (12inch)
Manufacturing 12-inch wafers is more difficult due to challenges in crystal growth, cutting, polishing, equipment limitations, yield issues, and quality control.
This complexity makes 12-inch wafers less common and more expensive compared to 4-inch, 6-inch, and 8-inch wafers.
Here are 4 points about why they are the most difficult ones.
1. Crystal Growth: It is very hard to maintain the uniformity of so large crystal while the small fluctuations in temperature and chemical composition can impact the quality.
Besides, larger crystals have a higher likelihood of internal defects such as dislocations and stress concentrations, which are harder to manage.
2. Processing Challenges: Cutting and grinding larger wafers require higher precision equipment and techniques. Any minor errors are magnified, leading to a higher defect rate.
Also, Polishing larger wafers takes more time and precision to ensure surface smoothness and consistent thickness.
3. Equipment and Cost: Manufacturing 12-inch wafers necessitates larger, more sophisticated equipment, leading to higher initial investment and maintenance costs.
In addition, Due to the increased difficulty and higher defect rates, the production cost for 12-inch wafers is significantly higher than for 8-inch and 6-inch wafers.
4. Thermal Treatment and Stress: Larger wafers are more prone to stress during thermal treatment, which can cause warping or cracking.
Furthermore, maintaining temperature uniformity during thermal processes is more challenging for larger wafers, affecting the final quality.
To sum up, the 12-inch sapphire wafers are the hardest ones to manufacture.
| Property | Specification |
| Name | Sapphire parts |
| Size | Customized |
| Density, g/cm3 | 3.98 |
| Hardness (Mohs) | 9 |
| Melting point, °K | 2050 |
| Surface Flatness | λ/4 @ 633 nm |
| Young's modulus | 3.4 x 1011 N m-2 |
| Thermal Limit | 22 W m-1 K-1 |
| Thermal expansion coefficient | 8.4 x 10-6 K-1 |
| Surface Quality | 40-20 scratch-dig |
| Crystal class | Hexagonal system, rhomboidal class 3m |
| Optical transmission range, µm | 0.17 - 5.5 |
| Refractive index at 0.532 µm | n0=1.7717, ne=1.76355 |
| Surface Quality | 40-20 scratch-dig |
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1. Q: How does the cost of sapphire wafers compare to other substrates?
A: Sapphire wafers are generally more expensive than silicon but offer superior thermal and optical properties.
2. Q: What is the typical yield rate for 12-inch sapphire wafer production?
A: Yield rates vary but are generally lower than smaller wafers due to the increased difficulty in producing large, defect-free crystals.
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